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Chemical content 74AVCH20T245DGG

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Type numberPackagePackage descriptionTotal product weight
74AVCH20T245DGGSOT364-1TSSOP56231.40436 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352862361181112601235Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1947577.900000.08416
PolymerAcrylic resinProprietary0.0380015.200000.01642
Resin systemProprietary0.017256.900000.00745
subTotal0.25000100.000000.10803
DieDoped siliconSilicon (Si)7440-21-31.80297100.000000.77914
subTotal1.80297100.000000.77914
Lead FrameCopper alloyCopper (Cu)7440-50-887.7275994.5850037.91095
Magnesium (Mg)7439-95-40.159530.172000.06894
Silicon (Si)7440-21-30.660840.712500.28558
Pure metal layerGold (Au)7440-57-50.027360.029500.01182
Nickel (Ni)7440-02-04.109294.430501.77580
Palladium (Pd)7440-05-30.045450.049000.01964
Silver (Ag)7440-22-40.019940.021500.00862
subTotal92.75000100.0000040.08135
Mould CompoundAdditiveNon hazardousProprietary6.406104.700002.76836
FillerSilica fused60676-86-0107.6770079.0000046.53197
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-88.178006.000003.53407
PigmentCarbon black1333-86-40.272600.200000.11780
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-65.452004.000002.35605
Non hazardousProprietary5.588304.100002.41495
Tetramethylbiphenyl diglycidyl ether85954-11-62.726002.000001.17802
subTotal136.30000100.0000058.90122
WirePure metalCopper (Cu)7440-50-80.30139100.000000.13024
subTotal0.30139100.000000.13024
total231.40436100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.