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Chemical content 74AVCH4T245BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AVCH4T245BQ-Q100SOT763-1DHVQFN1621.66425 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935302455115512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36855
PolymerResin systemProprietary0.0198419.900000.09156
subTotal0.09968100.000000.46011
DieDoped siliconSilicon (Si)7440-21-30.32196100.000001.48613
subTotal0.32196100.000001.48613
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.81029
Iron (Fe)7439-89-60.196362.400000.90638
Phosphorus (P)7723-14-00.002450.030000.01133
Zinc (Zn)7440-66-60.008180.100000.03777
subTotal8.18167100.0000037.76577
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67077
FillerSilica -amorphous-7631-86-90.434103.490002.00377
Silica fused60676-86-010.5503184.8200048.69917
PigmentCarbon black1333-86-40.019900.160000.09186
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62008
Epoxy resin systemProprietary0.197771.590000.91289
Phenolic resinProprietary0.279872.250001.29183
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.12434
subTotal12.43847100.0000057.41471
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07554
Nickel (Ni)7440-02-00.5035192.300002.32413
Palladium (Pd)7440-05-30.016913.100000.07806
Silver (Ag)7440-22-40.008731.600000.04029
subTotal0.54551100.000002.51802
WirePure metalCopper (Cu)7440-50-80.0743096.550000.34297
Pure metal layerGold (Au)7440-57-50.000270.350000.00124
Palladium (Pd)7440-05-30.002393.100000.01101
subTotal0.07696100.000000.35522
total21.66425100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.