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Chemical content 74AXP1T45GX

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Type numberPackagePackage descriptionTotal product weight
74AXP1T45GXSOT1255-2X2SON60.76555 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690967147412601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04977100.000006.50151
subTotal0.04977100.000006.50151
ComponentAdditiveNon hazardousProprietary0.000255.000000.03266
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03266
Silica -amorphous-7631-86-90.0025050.000000.32656
PolymerEpoxy resin systemProprietary0.0015030.000000.19594
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06531
subTotal0.00500100.000000.65313
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100035.80158
Magnesium (Mg)7439-95-40.000440.150000.05682
Nickel (Ni)7440-02-00.008562.950001.11750
Silicon (Si)7440-21-30.001860.640000.24244
Pure metal layerGold (Au)7440-57-50.000060.020000.00758
Nickel (Ni)7440-02-00.004761.640000.62125
Palladium (Pd)7440-05-30.000260.090000.03409
subTotal0.29000100.0000037.88126
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21315
FillerSilica -amorphous-7631-86-90.001150.290000.15077
Silica fused60676-86-00.3428886.1500044.78832
HardenerPhenolic resinProprietary0.017074.290002.23032
PigmentCarbon black1333-86-40.000760.190000.09878
PolymerEpoxy resin systemProprietary0.034518.670004.50743
subTotal0.39800100.0000051.98877
WireGold alloyGold (Au)7440-57-50.0225599.000002.94588
Palladium (Pd)7440-05-30.000231.000000.02976
subTotal0.02278100.000002.97564
total0.76555100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.