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Chemical content 74AXP8T245BQ

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Type numberPackagePackage descriptionTotal product weight
74AXP8T245BQSOT815-1DHVQFN2450.46463 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690813118412601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1018880.100000.20188
PolymerResin systemProprietary0.0253119.900000.05016
subTotal0.12719100.000000.25204
DieDoped siliconSilicon (Si)7440-21-30.62337100.000001.23527
subTotal0.62337100.000001.23527
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0783297.4700037.80533
Iron (Fe)7439-89-60.469762.400000.93088
Phosphorus (P)7723-14-00.005870.030000.01164
Zinc (Zn)7440-66-60.019570.100000.03879
subTotal19.57353100.0000038.78664
Mould CompoundAdditiveNon hazardousProprietary0.858522.910001.70123
FillerSilica -amorphous-7631-86-91.029633.490002.04031
Silica fused60676-86-025.0239484.8200049.58710
PigmentCarbon black1333-86-40.047200.160000.09354
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.318631.080000.63138
Epoxy resin systemProprietary0.469091.590000.92954
Phenolic resinProprietary0.663802.250001.31539
Tetramethylbiphenyl diglycidyl ether85954-11-61.091593.700002.16308
subTotal29.50241100.0000058.46157
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00985
Nickel (Ni)7440-02-00.4521491.000000.89596
Palladium (Pd)7440-05-30.039758.000000.07877
subTotal0.49686100.000000.98458
WirePure metalCopper (Cu)7440-50-80.1364096.550000.27028
Pure metal layerGold (Au)7440-57-50.000490.350000.00098
Palladium (Pd)7440-05-30.004383.100000.00868
subTotal0.14127100.000000.27994
total50.46463100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.