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Chemical content 74CB3Q3253BQ

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Type numberPackagePackage descriptionTotal product weight
74CB3Q3253BQSOT763-1DHVQFN1621.71943 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353392081151112601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13813
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09197
subTotal0.05000100.000000.23019
DieDoped siliconSilicon (Si)7440-21-30.71836100.000003.30746
subTotal0.71836100.000003.30746
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.03401
Iron (Fe)7439-89-60.198062.400000.91189
Phosphorus (P)7723-14-00.002480.030000.01140
Zinc (Zn)7440-66-60.008250.100000.03800
subTotal8.25236100.0000037.99530
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.66652
FillerSilica -amorphous-7631-86-90.434103.490001.99868
Silica fused60676-86-010.5503084.8200048.57541
PigmentCarbon black1333-86-40.019900.160000.09163
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61850
Epoxy resin systemProprietary0.197771.590000.91057
Phenolic resinProprietary0.279872.250001.28855
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11895
subTotal12.43846100.0000057.26881
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00964
Nickel (Ni)7440-02-00.1906391.000000.87768
Palladium (Pd)7440-05-30.016768.000000.07716
subTotal0.20948100.000000.96448
WirePure metalCopper (Cu)7440-50-80.0490296.550000.22570
Pure metal layerGold (Au)7440-57-50.000180.350000.00082
Palladium (Pd)7440-05-30.001573.100000.00725
subTotal0.05077100.000000.23377
total21.71943100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.