×

Chemical content 74CBTLV1G125GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74CBTLV1G125GMSOT886XSON61.93684 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352803171151112601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07290100.000003.76371
subTotal0.07290100.000003.76371
ComponentAdditiveNon hazardousProprietary0.000255.000000.01291
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01291
Silica -amorphous-7631-86-90.0025050.000000.12908
PolymerEpoxy resin systemProprietary0.0015030.000000.07745
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02582
subTotal0.00500100.000000.25817
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.67049
Magnesium (Mg)7439-95-40.001160.150000.05979
Nickel (Ni)7440-02-00.022772.950001.17583
Silicon (Si)7440-21-30.004940.640000.25510
Pure metal layerGold (Au)7440-57-50.000150.020000.00797
Nickel (Ni)7440-02-00.012661.640000.65368
Palladium (Pd)7440-05-30.000690.090000.03587
subTotal0.77200100.0000039.85873
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22566
FillerSilica -amorphous-7631-86-90.003090.290000.15961
Silica fused60676-86-00.9183686.1500047.41533
HardenerPhenolic resinProprietary0.045734.290002.36113
PigmentCarbon black1333-86-40.002030.190000.10457
PolymerEpoxy resin systemProprietary0.092428.670004.77180
subTotal1.06600100.0000055.03810
WireGold alloyGold (Au)7440-57-50.0207399.000001.07033
Palladium (Pd)7440-05-30.000211.000000.01081
subTotal0.02094100.000001.08114
total1.93684100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.