×

Chemical content 74CBTLV1G125GS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74CBTLV1G125GSSOT1202X2SON60.96831 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292892132512601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03645100.000003.76413
subTotal0.03645100.000003.76413
ComponentAdditiveNon hazardousProprietary0.000255.000000.02582
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02582
Silica -amorphous-7631-86-90.0025050.000000.25818
PolymerEpoxy resin systemProprietary0.0015030.000000.15491
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05164
subTotal0.00500100.000000.51637
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.09088
Magnesium (Mg)7439-95-40.000630.150000.06522
Nickel (Ni)7440-02-00.012422.950001.28260
Silicon (Si)7440-21-30.002690.640000.27826
Pure metal layerGold (Au)7440-57-50.000080.020000.00870
Nickel (Ni)7440-02-00.006901.640000.71304
Palladium (Pd)7440-05-30.000380.090000.03913
subTotal0.42100100.0000043.47783
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20790
FillerSilica -amorphous-7631-86-90.001420.290000.14705
Silica fused60676-86-00.4230086.1500043.68400
HardenerPhenolic resinProprietary0.021064.290002.17533
PigmentCarbon black1333-86-40.000930.190000.09634
PolymerEpoxy resin systemProprietary0.042578.670004.39629
subTotal0.49100100.0000050.70691
WireGold alloyGold (Au)7440-57-50.0147299.000001.51980
Palladium (Pd)7440-05-30.000151.000000.01535
subTotal0.01486100.000001.53515
total0.96831100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.