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Chemical content 74CBTLV3126BQ

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Type numberPackagePackage descriptionTotal product weight
74CBTLV3126BQSOT762-1DHVQFN1421.81162 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935289342115812601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43334
PolymerResin systemProprietary0.0234819.900000.10766
subTotal0.11800100.000000.54100
DieDoped siliconSilicon (Si)7440-21-30.19560100.000000.89679
subTotal0.19560100.000000.89679
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.63391
Iron (Fe)7439-89-60.205522.346100.94224
Phosphorus (P)7723-14-00.002650.030200.01213
Zinc (Zn)7440-66-60.008890.101500.04076
Pure metal layerGold (Au)7440-57-50.002650.030200.01213
Nickel (Ni)7440-02-00.106921.220500.49018
Palladium (Pd)7440-05-30.004910.056000.02249
Silver (Ag)7440-22-40.001800.020500.00823
subTotal8.76000100.0000040.16207
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69250
FillerSilica -amorphous-7631-86-90.442743.490002.02984
Silica fused60676-86-010.7602784.8200049.33272
PigmentCarbon black1333-86-40.020300.160000.09306
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62815
Epoxy resin systemProprietary0.201711.590000.92477
Phenolic resinProprietary0.285442.250001.30864
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15198
subTotal12.68600100.0000058.16166
WirePure metalCopper (Cu)7440-50-80.0502296.550000.23026
Pure metal layerGold (Au)7440-57-50.000180.350000.00083
Palladium (Pd)7440-05-30.001613.100000.00739
subTotal0.05202100.000000.23848
total21.81162100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.