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Chemical content 74CBTLV3244BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74CBTLV3244BQ-Q100SOT764-1DHVQFN2028.51694 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691510115312601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.23954
PolymerResin systemProprietary0.0169719.900000.05951
subTotal0.08528100.000000.29905
DieDoped siliconSilicon (Si)7440-21-30.48653100.000001.70610
subTotal0.48653100.000001.70610
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700036.81487
Iron (Fe)7439-89-60.258502.400000.90649
Phosphorus (P)7723-14-00.003230.030000.01133
Zinc (Zn)7440-66-60.010770.100000.03777
subTotal10.77098100.0000037.77046
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67097
FillerSilica -amorphous-7631-86-90.571483.490002.00402
Silica fused60676-86-013.8892184.8200048.70511
PigmentCarbon black1333-86-40.026200.160000.09187
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62015
Epoxy resin systemProprietary0.260361.590000.91301
Phenolic resinProprietary0.368442.250001.29199
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.12460
subTotal16.37492100.0000057.42172
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07555
Nickel (Ni)7440-02-00.6628292.300002.32432
Palladium (Pd)7440-05-30.022263.100000.07806
Silver (Ag)7440-22-40.011491.600000.04029
subTotal0.71812100.000002.51822
WirePure metalCopper (Cu)7440-50-80.0783196.550000.27462
Pure metal layerGold (Au)7440-57-50.000280.350000.00100
Palladium (Pd)7440-05-30.002513.100000.00882
subTotal0.08111100.000000.28444
total28.51694100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.