Chemical content 74CBTLV3245BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74CBTLV3245BQ-Q100SOT764-1DHVQFN2028.16274 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935308527115612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00303
FillerSilver (Ag)7440-22-40.0639675.000000.22711
PolymerAcrylic resinProprietary0.005126.000000.01817
Resin systemProprietary0.0153518.000000.05451
DieDoped siliconSilicon (Si)7440-21-30.48653100.000001.72756
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.59917
Iron (Fe)7439-89-60.260732.400000.92580
Phosphorus (P)7723-14-00.003260.030000.01157
Zinc (Zn)7440-66-60.010860.100000.03858
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.69199
FillerSilica -amorphous-7631-86-90.571483.490002.02922
Silica fused60676-86-013.8892184.8200049.31767
PigmentCarbon black1333-86-40.026200.160000.09303
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62795
Epoxy resin systemProprietary0.260361.590000.92449
Phenolic resinProprietary0.368442.250001.30824
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.15132
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00979
Nickel (Ni)7440-02-00.2509691.000000.89111
Palladium (Pd)7440-05-30.022068.000000.07834
WirePure metalCopper (Cu)7440-50-80.0737996.550000.26200
Pure metal layerGold (Au)7440-57-50.000270.350000.00095
Palladium (Pd)7440-05-30.002373.100000.00841
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.