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Chemical content 74CBTLV3306GT

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Type numberPackagePackage descriptionTotal product weight
74CBTLV3306GTSOT833-1XSON82.50754 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935308825115512601235Seremban, Malaysia; Suzhou, China; Shanghai, China; Bangkok, Thailand; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10485100.000004.18139
subTotal0.10485100.000004.18139
ComponentAdditiveNon hazardousProprietary0.000755.000000.02991
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02991
Silica -amorphous-7631-86-90.0075050.000000.29910
PolymerEpoxy resin systemProprietary0.0045030.000000.17946
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05982
subTotal0.01500100.000000.59820
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.23938
Magnesium (Mg)7439-95-40.001530.145700.06118
Nickel (Ni)7440-02-00.030682.914001.22369
Silicon (Si)7440-21-30.006650.631400.26515
Pure metal layerGold (Au)7440-57-50.000370.035000.01470
Nickel (Ni)7440-02-00.028562.712001.13886
Palladium (Pd)7440-05-30.001260.120000.05039
subTotal1.05300100.0000041.99335
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21289
FillerSilica -amorphous-7631-86-90.003780.290000.15058
Silica fused60676-86-01.1216786.1500044.73201
HardenerPhenolic resinProprietary0.055864.290002.22751
PigmentCarbon black1333-86-40.002470.190000.09865
PolymerEpoxy resin systemProprietary0.112888.670004.50176
subTotal1.30200100.0000051.92340
WireGold alloyGold (Au)7440-57-50.0323799.000001.29083
Palladium (Pd)7440-05-30.000331.000000.01304
subTotal0.03270100.000001.30387
total2.50754100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.