Chemical content 74CBTLVD3244BQ

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Type numberPackagePackage descriptionTotal product weight
74CBTLVD3244BQSOT764-1DHVQFN2028.36225 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935294099115912601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24085
PolymerResin systemProprietary0.0169719.900000.05984
DieDoped siliconSilicon (Si)7440-21-30.68114100.000002.40157
Lead Frame MaterialCopper alloyZinc (Zn)7440-66-60.010860.100000.03830
Iron (Fe)7439-89-60.260742.400000.91931
Copper (Cu)7440-50-810.5891697.4700037.33540
Phosphorus (P)7723-14-00.003260.030000.01149
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.68008
FillerSilica -amorphous-7631-86-90.571483.490002.01495
Silica fused60676-86-013.8892084.8200048.97072
PigmentCarbon black1333-86-40.026200.160000.09238
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62354
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13619
Phenolic resinProprietary0.368442.250001.29903
Epoxy resin systemProprietary0.260361.590000.91798
Pre-PlatingPure metal layerNickel (Ni)7440-02-00.2509591.000000.88481
Gold (Au)7440-57-50.002761.000000.00972
Palladium (Pd)7440-05-30.022068.000000.07779
WirePure metalCopper (Cu)7440-50-80.0783396.550000.27617
Pure metal layerGold (Au)7440-57-50.000280.350000.00100
Palladium (Pd)7440-05-30.002513.100000.00887
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.