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Chemical content 74HC00BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC00BQ-Q100SOT762-1DHVQFN1418.17110 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298683115612601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10253
PolymerResin systemProprietary0.0046319.900000.02547
subTotal0.02326100.000000.12800
DieDoped siliconSilicon (Si)7440-21-30.18786100.000001.03382
subTotal0.18786100.000001.03382
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.11778
Iron (Fe)7439-89-60.166072.400000.91395
Phosphorus (P)7723-14-00.002080.030000.01142
Zinc (Zn)7440-66-60.006920.100000.03808
subTotal6.91978100.0000038.08123
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68472
FillerSilica -amorphous-7631-86-90.367153.490002.02051
Silica fused60676-86-08.9230784.8200049.10585
PigmentCarbon black1333-86-40.016830.160000.09263
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62526
Epoxy resin systemProprietary0.167271.590000.92052
Phenolic resinProprietary0.236702.250001.30262
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14208
subTotal10.52001100.0000057.89419
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07618
Nickel (Ni)7440-02-00.4258792.300002.34368
Palladium (Pd)7440-05-30.014303.100000.07872
Silver (Ag)7440-22-40.007381.600000.04063
subTotal0.46140100.000002.53921
WirePure metalCopper (Cu)7440-50-80.0567796.550000.31240
Pure metal layerGold (Au)7440-57-50.000210.350000.00113
Palladium (Pd)7440-05-30.001823.100000.01003
subTotal0.05880100.000000.32356
total18.17110100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.