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Chemical content 74HC08BQ

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Type numberPackagePackage descriptionTotal product weight
74HC08BQSOT762-1DHVQFN1421.80793 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736831151812601235Suzhou, China; Hsin-chu, Taiwan; Bangkok, Thailand; Jiangyin, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43341
PolymerResin systemProprietary0.0234819.900000.10768
subTotal0.11800100.000000.54109
DieDoped siliconSilicon (Si)7440-21-30.19236100.000000.88209
subTotal0.19236100.000000.88209
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.64045
Iron (Fe)7439-89-60.205522.346100.94240
Phosphorus (P)7723-14-00.002650.030200.01213
Zinc (Zn)7440-66-60.008890.101500.04077
Pure metal layerGold (Au)7440-57-50.002650.030200.01213
Nickel (Ni)7440-02-00.106921.220500.49026
Palladium (Pd)7440-05-30.004910.056000.02249
Silver (Ag)7440-22-40.001800.020500.00823
subTotal8.76000100.0000040.16886
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69279
FillerSilica -amorphous-7631-86-90.442743.490002.03019
Silica fused60676-86-010.7602784.8200049.34107
PigmentCarbon black1333-86-40.020300.160000.09307
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62825
Epoxy resin systemProprietary0.201711.590000.92493
Phenolic resinProprietary0.285442.250001.30886
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15235
subTotal12.68600100.0000058.17151
WirePure metalCopper (Cu)7440-50-80.0497896.550000.22828
Pure metal layerGold (Au)7440-57-50.000180.350000.00083
Palladium (Pd)7440-05-30.001603.100000.00733
subTotal0.05156100.000000.23644
total21.80793100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.