Chemical content 74HC112PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC112PW-Q100SOT403-1TSSOP1661.22997 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691580118312601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21628
PolymerAcrylic resinProprietary0.0258415.200000.04220
Resin systemProprietary0.011736.900000.01916
DieDoped siliconSilicon (Si)7440-21-31.05322100.000001.72010
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.54203
Iron (Fe)7439-89-60.475552.400000.77666
Phosphorus (P)7723-14-00.005940.030000.00971
Zinc (Zn)7440-66-60.019810.100000.03236
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.38805
Silica fused60676-86-031.0186878.3300050.65931
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.94513
PigmentCarbon black1333-86-40.079200.200000.12935
PolymerEpoxy resin systemProprietary3.509358.862005.73143
Phenolic resinProprietary2.339575.908003.82095
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02464
Nickel (Ni)7440-02-00.4642592.300000.75821
Palladium (Pd)7440-05-30.015593.100000.02547
Silver (Ag)7440-22-40.008051.600000.01314
WirePure metalCopper (Cu)7440-50-80.08929100.000000.14583
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.