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Chemical content 74HC14BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC14BQ-Q100SOT762-1DHVQFN1418.20223 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298439115912601235Shanghai, China; Suzhou, China; Nijmegen, Netherlands; Jiangyin, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10236
PolymerResin systemProprietary0.0046319.900000.02543
subTotal0.02326100.000000.12779
DieDoped siliconSilicon (Si)7440-21-30.22504100.000001.23635
subTotal0.22504100.000001.23635
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.05430
Iron (Fe)7439-89-60.166072.400000.91239
Phosphorus (P)7723-14-00.002080.030000.01140
Zinc (Zn)7440-66-60.006920.100000.03802
subTotal6.91978100.0000038.01611
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68184
FillerSilica -amorphous-7631-86-90.367153.490002.01705
Silica fused60676-86-08.9230784.8200049.02186
PigmentCarbon black1333-86-40.016830.160000.09247
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62419
Epoxy resin systemProprietary0.167271.590000.91894
Phenolic resinProprietary0.236702.250001.30039
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.13842
subTotal10.52001100.0000057.79516
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07605
Nickel (Ni)7440-02-00.4258792.300002.33967
Palladium (Pd)7440-05-30.014303.100000.07858
Silver (Ag)7440-22-40.007381.600000.04056
subTotal0.46140100.000002.53486
WirePure metalCopper (Cu)7440-50-80.0509296.550000.27974
Pure metal layerGold (Au)7440-57-50.000180.350000.00101
Palladium (Pd)7440-05-30.001633.100000.00898
subTotal0.05274100.000000.28973
total18.20223100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.