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Chemical content 74HC14BQ

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Type numberPackagePackage descriptionTotal product weight
74HC14BQSOT762-1DHVQFN1421.84020 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352734861152012601235Hsin-chu, Taiwan; Bangkok, Thailand; Suzhou, China; Shanghai, China; Nijmegen, Netherlands; Jiangyin, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43277
PolymerResin systemProprietary0.0234819.900000.10752
subTotal0.11800100.000000.54029
DieDoped siliconSilicon (Si)7440-21-30.22504100.000001.03041
subTotal0.22504100.000001.03041
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.58336
Iron (Fe)7439-89-60.205522.346100.94101
Phosphorus (P)7723-14-00.002650.030200.01211
Zinc (Zn)7440-66-60.008890.101500.04071
Pure metal layerGold (Au)7440-57-50.002650.030200.01211
Nickel (Ni)7440-02-00.106921.220500.48954
Palladium (Pd)7440-05-30.004910.056000.02246
Silver (Ag)7440-22-40.001800.020500.00822
subTotal8.76000100.0000040.10952
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69029
FillerSilica -amorphous-7631-86-90.442743.490002.02719
Silica fused60676-86-010.7602784.8200049.26816
PigmentCarbon black1333-86-40.020300.160000.09294
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62732
Epoxy resin systemProprietary0.201711.590000.92356
Phenolic resinProprietary0.285442.250001.30692
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.14917
subTotal12.68600100.0000058.08555
WirePure metalCopper (Cu)7440-50-80.0494096.550000.22617
Pure metal layerGold (Au)7440-57-50.000180.350000.00082
Palladium (Pd)7440-05-30.001593.100000.00726
subTotal0.05116100.000000.23425
total21.84020100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.