Chemical content 74HC151BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC151BQ-Q100SOT763-1DHVQFN1621.41831 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691306115412601235Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00465
FillerSilver (Ag)7440-22-40.0747675.000000.34905
PolymerAcrylic resinProprietary0.005986.000000.02792
Resin systemProprietary0.0179418.000000.08377
DieDoped siliconSilicon (Si)7440-21-30.35981100.000001.67992
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0434197.4700037.55389
Iron (Fe)7439-89-60.198052.400000.92469
Phosphorus (P)7723-14-00.002480.030000.01156
Zinc (Zn)7440-66-60.008250.100000.03853
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.68995
FillerSilica -amorphous-7631-86-90.434103.490002.02678
Silica fused60676-86-010.5503184.8200049.25837
PigmentCarbon black1333-86-40.019900.160000.09292
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62720
Epoxy resin systemProprietary0.197771.590000.92338
Phenolic resinProprietary0.279872.250001.30667
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.14874
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00978
Nickel (Ni)7440-02-00.1906491.000000.89006
Palladium (Pd)7440-05-30.016768.000000.07825
WirePure metalCopper (Cu)7440-50-80.0566596.550000.26448
Pure metal layerGold (Au)7440-57-50.000210.350000.00096
Palladium (Pd)7440-05-30.001823.100000.00849
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.