Chemical content 74HC164BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC164BQ-Q100SOT762-1DHVQFN1418.21138 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9353027771151312601235Bangkok, Thailand; Nijmegen, Netherlands; Jiangyin, China; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00128
FillerSilver (Ag)7440-22-40.0174475.000000.09579
PolymerAcrylic resinProprietary0.001406.000000.00766
Resin systemProprietary0.0041918.000000.02299
DieDoped siliconSilicon (Si)7440-21-30.23655100.000001.29893
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.03569
Iron (Fe)7439-89-60.166072.400000.91193
Phosphorus (P)7723-14-00.002080.030000.01140
Zinc (Zn)7440-66-60.006920.100000.03800
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68099
FillerSilica -amorphous-7631-86-90.367153.490002.01604
Silica fused60676-86-08.9230784.8200048.99723
PigmentCarbon black1333-86-40.016830.160000.09243
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62387
Epoxy resin systemProprietary0.167271.590000.91848
Phenolic resinProprietary0.236702.250001.29974
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.13735
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07601
Nickel (Ni)7440-02-00.4258792.300002.33849
Palladium (Pd)7440-05-30.014303.100000.07854
Silver (Ag)7440-22-40.007381.600000.04054
WirePure metalCopper (Cu)7440-50-80.0486396.550000.26705
Pure metal layerGold (Au)7440-57-50.000180.350000.00097
Palladium (Pd)7440-05-30.001563.100000.00857
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.