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Chemical content 74HC164BQ

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Type numberPackagePackage descriptionTotal product weight
74HC164BQSOT762-1DHVQFN1421.85255 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352911381151112601235Hsin-chu, Taiwan; Shanghai, China; Bangkok, Thailand; Jiangyin, China; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43253
PolymerResin systemProprietary0.0234819.900000.10746
subTotal0.11800100.000000.53999
DieDoped siliconSilicon (Si)7440-21-30.23655100.000001.08250
subTotal0.23655100.000001.08250
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.56155
Iron (Fe)7439-89-60.205522.346100.94048
Phosphorus (P)7723-14-00.002650.030200.01211
Zinc (Zn)7440-66-60.008890.101500.04069
Pure metal layerGold (Au)7440-57-50.002650.030200.01211
Nickel (Ni)7440-02-00.106921.220500.48926
Palladium (Pd)7440-05-30.004910.056000.02245
Silver (Ag)7440-22-40.001800.020500.00822
subTotal8.76000100.0000040.08687
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.68933
FillerSilica -amorphous-7631-86-90.442743.490002.02604
Silica fused60676-86-010.7602784.8200049.24032
PigmentCarbon black1333-86-40.020300.160000.09288
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62697
Epoxy resin systemProprietary0.201711.590000.92304
Phenolic resinProprietary0.285442.250001.30619
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.14795
subTotal12.68600100.0000058.05272
WirePure metalCopper (Cu)7440-50-80.0502096.550000.22974
Pure metal layerGold (Au)7440-57-50.000180.350000.00083
Palladium (Pd)7440-05-30.001613.100000.00738
subTotal0.05200100.000000.23795
total21.85255100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.