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Chemical content 74HC165BQ

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Type numberPackagePackage descriptionTotal product weight
74HC165BQSOT763-1DHVQFN1622.03463 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352860731151312601235Suzhou, China; Bangkok, Thailand; Hsin-chu, Taiwan; Shanghai, China; Nijmegen, Netherlands; Jiangyin, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29445
PolymerResin systemProprietary0.0161219.900000.07315
subTotal0.08100100.000000.36760
DieDoped siliconSilicon (Si)7440-21-30.35649100.000001.61786
subTotal0.35649100.000001.61786
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.56806
Iron (Fe)7439-89-60.237082.320001.07595
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03710
Zinc (Zn)7440-66-60.012260.120000.05565
Gold alloyGold (Au)7440-57-50.003060.029970.01390
Silver (Ag)7440-22-40.002040.019980.00927
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02317
Nickel (Ni)7440-02-00.130671.278720.59303
subTotal10.21900100.0000046.37695
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49471
FillerSilica -amorphous-7631-86-90.395003.490001.79262
Silica fused60676-86-09.5999384.8200043.56746
PigmentCarbon black1333-86-40.018110.160000.08218
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55474
Epoxy resin systemProprietary0.179961.590000.81670
Phenolic resinProprietary0.254662.250001.15570
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.90049
subTotal11.31800100.0000051.36460
WirePure metalCopper (Cu)7440-50-80.0580696.550000.26350
Pure metal layerGold (Au)7440-57-50.000210.350000.00096
Palladium (Pd)7440-05-30.001863.100000.00846
subTotal0.06014100.000000.27292
total22.03463100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.