Chemical content 74HC166PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC166PW-Q100SOT403-1TSSOP1661.26507 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301536118512601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21616
PolymerAcrylic resinProprietary0.0258415.200000.04218
Resin systemProprietary0.011736.900000.01915
DieDoped siliconSilicon (Si)7440-21-31.09010100.000001.77932
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.52396
Iron (Fe)7439-89-60.475552.400000.77621
Phosphorus (P)7723-14-00.005940.030000.00970
Zinc (Zn)7440-66-60.019810.100000.03234
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.38782
Silica fused60676-86-031.0186878.3300050.63029
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.94287
PigmentCarbon black1333-86-40.079200.200000.12927
PolymerEpoxy resin systemProprietary3.509358.862005.72814
Phenolic resinProprietary2.339575.908003.81876
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02463
Nickel (Ni)7440-02-00.4642592.300000.75777
Palladium (Pd)7440-05-30.015593.100000.02545
Silver (Ag)7440-22-40.008051.600000.01314
WirePure metalCopper (Cu)7440-50-80.08750100.000000.14283
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.