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Chemical content 74HC1G02GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC1G02GW-Q100SOT353-1UMT55.67627 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298774125712601235Bangkok, Thailand; Shanghai, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12843
PolymerResin systemProprietary0.0024325.000000.04281
subTotal0.00972100.000000.17124
DieDoped siliconSilicon (Si)7440-21-30.08038100.000001.41616
subTotal0.08038100.000001.41616
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.60918
Iron (Fe)7439-89-60.045512.310000.80171
Lead (Pb)7439-92-10.000200.010000.00347
Phosphorus (P)7723-14-00.001380.070000.02429
Zinc (Zn)7440-66-60.002360.120000.04165
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22559
subTotal1.97000100.0000034.70589
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.11448
Silica fused60676-86-02.3217570.5700040.90279
PigmentCarbon black1333-86-40.006580.200000.11592
PolymerEpoxy resin systemProprietary0.305649.290005.38454
Phenolic resinProprietary0.195435.940003.44286
subTotal3.29000100.0000057.96059
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.46079
subTotal0.31000100.000005.46132
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0161699.990000.28474
subTotal0.01616100.000000.28477
total5.67627100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.