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Chemical content 74HC1G04GV

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Type numberPackagePackage descriptionTotal product weight
74HC1G04GVSOT753SO510.51375 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352718841251912601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0150075.000000.14267
PolymerResin systemProprietary0.0050025.000000.04756
subTotal0.02000100.000000.19023
DieDoped siliconSilicon (Si)7440-21-30.15656100.000001.48914
subTotal0.15656100.000001.48914
Lead FrameCopper alloyCopper (Cu)7440-50-83.3397894.8800031.76579
Iron (Fe)7439-89-60.089412.540000.85039
Lead (Pb)7439-92-10.001060.030000.01004
Phosphorus (P)7723-14-00.005280.150000.05022
Tin (Sn)7440-31-50.007040.200000.06696
Pure metal layerSilver (Ag)7440-22-40.077442.200000.73656
subTotal3.52000100.0000033.47996
Mould CompoundFillerSilica fused60676-86-04.5085071.0000042.88194
PigmentCarbon black1333-86-40.019050.300000.18119
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2509519.7000011.89823
Phenolic resinProprietary0.571509.000005.43574
subTotal6.35000100.0000060.39710
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.18458
subTotal0.44000100.000004.18500
WireGold alloyGold (Au)7440-57-50.0269199.000000.25598
Palladium (Pd)7440-05-30.000271.000000.00259
subTotal0.02718100.000000.25857
total10.51375100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.