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Chemical content 74HC1G125GV-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC1G125GV-Q100SOT753SO510.52344 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299989125512601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0150075.000000.14254
PolymerResin systemProprietary0.0050025.000000.04751
subTotal0.02000100.000000.19005
DieDoped siliconSilicon (Si)7440-21-30.16071100.000001.52718
subTotal0.16071100.000001.52718
Lead FrameCopper alloyCopper (Cu)7440-50-83.3397894.8800031.73654
Iron (Fe)7439-89-60.089412.540000.84961
Lead (Pb)7439-92-10.001060.030000.01003
Phosphorus (P)7723-14-00.005280.150000.05017
Tin (Sn)7440-31-50.007040.200000.06690
Pure metal layerSilver (Ag)7440-22-40.077442.200000.73588
subTotal3.52000100.0000033.44913
Mould CompoundFillerSilica fused60676-86-04.5085071.0000042.84245
PigmentCarbon black1333-86-40.019050.300000.18102
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2509519.7000011.88727
Phenolic resinProprietary0.571509.000005.43073
subTotal6.35000100.0000060.34147
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.18072
subTotal0.44000100.000004.18114
WireGold alloyGold (Au)7440-57-50.0324099.000000.30786
Palladium (Pd)7440-05-30.000331.000000.00311
subTotal0.03272100.000000.31097
total10.52344100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.