Chemical content 74HC1G66GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC1G66GW-Q100SOT353-1UMT55.42735 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935299993125712601235Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0300075.000000.55276
PolymerResin systemProprietary0.0100025.000000.18425
DieDoped siliconSilicon (Si)7440-21-30.16279100.000002.99935
Lead FrameCopper alloyCopper (Cu)7440-50-81.8818097.0000034.67254
Iron (Fe)7439-89-60.048892.520000.90077
Lead (Pb)7439-92-10.000580.030000.01072
Phosphorus (P)7723-14-00.002910.150000.05362
Zinc (Zn)7440-66-60.003880.200000.07149
Pure metal layerSilver (Ag)7440-22-40.001940.100000.03574
Mould CompoundAdditiveNon hazardousProprietary0.089032.900001.64040
FillerSilica -amorphous-7631-86-92.2104072.0000040.72706
PigmentCarbon black1333-86-40.001540.050000.02828
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4605015.000008.48480
Phenol Formaldehyde resin (generic)9003-35-40.3070010.000005.65654
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00018
Tin solderTin (Sn)7440-31-50.1999899.990003.68467
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0145699.990000.26824
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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