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Chemical content 74HC240BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC240BQ-Q100SOT764-1DHVQFN2028.36560 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298786115512601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24082
PolymerResin systemProprietary0.0169719.900000.05983
subTotal0.08528100.000000.30065
DieDoped siliconSilicon (Si)7440-21-30.32937100.000001.16116
subTotal0.32937100.000001.16116
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700037.01129
Iron (Fe)7439-89-60.258502.400000.91133
Phosphorus (P)7723-14-00.003230.030000.01139
Zinc (Zn)7440-66-60.010770.100000.03797
subTotal10.77098100.0000037.97198
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67989
FillerSilica -amorphous-7631-86-90.571483.490002.01471
Silica fused60676-86-013.8892184.8200048.96497
PigmentCarbon black1333-86-40.026200.160000.09236
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62346
Epoxy resin systemProprietary0.260361.590000.91788
Phenolic resinProprietary0.368442.250001.29888
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13594
subTotal16.37492100.0000057.72809
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07595
Nickel (Ni)7440-02-00.6628292.300002.33672
Palladium (Pd)7440-05-30.022263.100000.07848
Silver (Ag)7440-22-40.011491.600000.04051
subTotal0.71812100.000002.53166
WirePure metalCopper (Cu)7440-50-80.0839396.550000.29590
Pure metal layerGold (Au)7440-57-50.000300.350000.00107
Palladium (Pd)7440-05-30.002693.100000.00950
subTotal0.08693100.000000.30647
total28.36560100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.