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Chemical content 74HC244BQ

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Type numberPackagePackage descriptionTotal product weight
74HC244BQSOT764-1DHVQFN2028.00255 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736781151512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24394
PolymerResin systemProprietary0.0169719.900000.06060
subTotal0.08528100.000000.30454
DieDoped siliconSilicon (Si)7440-21-30.31520100.000001.12562
subTotal0.31520100.000001.12562
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.81499
Iron (Fe)7439-89-60.260742.400000.93112
Phosphorus (P)7723-14-00.003260.030000.01164
Zinc (Zn)7440-66-60.010860.100000.03880
subTotal10.86402100.0000038.79655
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70167
FillerSilica -amorphous-7631-86-90.571483.490002.04083
Silica fused60676-86-013.8892084.8200049.59976
PigmentCarbon black1333-86-40.026200.160000.09356
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63155
Epoxy resin systemProprietary0.260361.590000.92978
Phenolic resinProprietary0.368442.250001.31572
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16363
subTotal16.37491100.0000058.47650
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00985
Nickel (Ni)7440-02-00.2509591.000000.89617
Palladium (Pd)7440-05-30.022068.000000.07878
subTotal0.27577100.000000.98480
WirePure metalCopper (Cu)7440-50-80.0843596.550000.30124
Pure metal layerGold (Au)7440-57-50.000310.350000.00109
Palladium (Pd)7440-05-30.002713.100000.00967
subTotal0.08737100.000000.31200
total28.00255100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.