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Chemical content 74HC253BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC253BQ-Q100SOT763-1DHVQFN1621.89216 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691309115412601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13704
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09125
subTotal0.05000100.000000.22838
DieDoped siliconSilicon (Si)7440-21-30.89077100.000004.06890
subTotal0.89077100.000004.06890
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.74181
Iron (Fe)7439-89-60.198062.400000.90469
Phosphorus (P)7723-14-00.002480.030000.01131
Zinc (Zn)7440-66-60.008250.100000.03770
subTotal8.25236100.0000037.69551
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65337
FillerSilica -amorphous-7631-86-90.434103.490001.98291
Silica fused60676-86-010.5503084.8200048.19215
PigmentCarbon black1333-86-40.019900.160000.09091
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61362
Epoxy resin systemProprietary0.197771.590000.90339
Phenolic resinProprietary0.279872.250001.27838
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.10223
subTotal12.43846100.0000056.81696
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00957
Nickel (Ni)7440-02-00.1906391.000000.87075
Palladium (Pd)7440-05-30.016768.000000.07655
subTotal0.20948100.000000.95687
WirePure metalCopper (Cu)7440-50-80.0493396.550000.22533
Pure metal layerGold (Au)7440-57-50.000180.350000.00082
Palladium (Pd)7440-05-30.001583.100000.00723
subTotal0.05109100.000000.23338
total21.89216100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.