Chemical content 74HC259BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC259BQ-Q100SOT763-1DHVQFN1621.81236 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298821115812601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00457
FillerSilver (Ag)7440-22-40.0747675.000000.34274
PolymerAcrylic resinProprietary0.005986.000000.02742
Resin systemProprietary0.0179418.000000.08226
DieDoped siliconSilicon (Si)7440-21-30.49157100.000002.25364
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.56034
Iron (Fe)7439-89-60.196362.400000.90022
Phosphorus (P)7723-14-00.002450.030000.01125
Zinc (Zn)7440-66-60.008180.100000.03751
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65942
FillerSilica -amorphous-7631-86-90.434103.490001.99017
Silica fused60676-86-010.5503184.8200048.36849
PigmentCarbon black1333-86-40.019900.160000.09124
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61587
Epoxy resin systemProprietary0.197771.590000.90670
Phenolic resinProprietary0.279872.250001.28306
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.10992
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07503
Nickel (Ni)7440-02-00.5035192.300002.30835
Palladium (Pd)7440-05-30.016913.100000.07753
Silver (Ag)7440-22-40.008731.600000.04001
WirePure metalCopper (Cu)7440-50-80.0535496.550000.24547
Pure metal layerGold (Au)7440-57-50.000190.350000.00089
Palladium (Pd)7440-05-30.001723.100000.00788
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.