Chemical content 74HC259PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC259PW-Q100SOT403-1TSSOP1660.68053 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298823118812601235Shanghai, China; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21824
PolymerAcrylic resinProprietary0.0258415.200000.04258
Resin systemProprietary0.011736.900000.01933
DieDoped siliconSilicon (Si)7440-21-30.49157100.000000.81010
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.82763
Iron (Fe)7439-89-60.475552.400000.78369
Phosphorus (P)7723-14-00.005940.030000.00980
Zinc (Zn)7440-66-60.019810.100000.03265
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39156
Silica fused60676-86-031.0186878.3300051.11801
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.98085
PigmentCarbon black1333-86-40.079200.200000.13052
PolymerEpoxy resin systemProprietary3.509358.862005.78332
Phenolic resinProprietary2.339575.908003.85555
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02487
Nickel (Ni)7440-02-00.4642592.300000.76507
Palladium (Pd)7440-05-30.015593.100000.02570
Silver (Ag)7440-22-40.008051.600000.01326
WirePure metalCopper (Cu)7440-50-80.10150100.000000.16727
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.