×

Chemical content 74HC2G04GW-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC2G04GW-Q100SOT363-2SC-885.74588 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935303404125712601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0073675.000000.12805
PolymerResin systemProprietary0.0024525.000000.04268
subTotal0.00981100.000000.17073
DieDoped siliconSilicon (Si)7440-21-30.09611100.000001.67272
subTotal0.09611100.000001.67272
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.56155
Iron (Fe)7439-89-60.048742.310000.84828
Lead (Pb)7439-92-10.000210.010000.00367
Phosphorus (P)7723-14-00.001480.070000.02571
Zinc (Zn)7440-66-60.002530.120000.04407
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23869
subTotal2.11000100.0000036.72197
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.65070
Silica fused60676-86-02.2159070.5700038.56499
PigmentCarbon black1333-86-40.006280.200000.10930
PolymerEpoxy resin systemProprietary0.291719.290005.07679
Phenolic resinProprietary0.186525.940003.24608
subTotal3.14000100.0000054.64786
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.43875
subTotal0.37000100.000006.43938
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0199599.990000.34727
subTotal0.01996100.000000.34730
total5.74588100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.