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Chemical content 74HC373BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC373BQ-Q100SOT764-1DHVQFN2028.37186 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299034115512601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24076
PolymerResin systemProprietary0.0169719.900000.05982
subTotal0.08528100.000000.30058
DieDoped siliconSilicon (Si)7440-21-30.33521100.000001.18147
subTotal0.33521100.000001.18147
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700037.00312
Iron (Fe)7439-89-60.258502.400000.91113
Phosphorus (P)7723-14-00.003230.030000.01139
Zinc (Zn)7440-66-60.010770.100000.03796
subTotal10.77098100.0000037.96360
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67952
FillerSilica -amorphous-7631-86-90.571483.490002.01427
Silica fused60676-86-013.8892184.8200048.95416
PigmentCarbon black1333-86-40.026200.160000.09234
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62333
Epoxy resin systemProprietary0.260361.590000.91767
Phenolic resinProprietary0.368442.250001.29860
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13547
subTotal16.37492100.0000057.71536
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07593
Nickel (Ni)7440-02-00.6628292.300002.33620
Palladium (Pd)7440-05-30.022263.100000.07846
Silver (Ag)7440-22-40.011491.600000.04050
subTotal0.71812100.000002.53109
WirePure metalCopper (Cu)7440-50-80.0843496.550000.29726
Pure metal layerGold (Au)7440-57-50.000310.350000.00108
Palladium (Pd)7440-05-30.002713.100000.00954
subTotal0.08735100.000000.30788
total28.37186100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.