Chemical content 74HC390PW

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Type numberPackagePackage descriptionTotal product weight
74HC390PWSOT403-1TSSOP1653.59801 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9351890601181312601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.21801
PolymerAcrylic resinProprietary0.0228015.200000.04254
Resin systemProprietary0.010356.900000.01931
DieDoped siliconSilicon (Si)7440-21-30.96619100.000001.80267
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.11635
Iron (Fe)7439-89-60.489842.400000.91391
Phosphorus (P)7723-14-00.006120.030000.01142
Zinc (Zn)7440-66-60.020410.100000.03808
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.77801
FillerSilica fused60676-86-025.0272079.0000046.69427
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.54640
PigmentCarbon black1333-86-40.063360.200000.11821
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.36427
Non hazardousProprietary1.298884.100002.42337
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.18213
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00560
Nickel (Ni)7440-02-00.2910097.000000.54293
Palladium (Pd)7440-05-30.006002.000000.01119
WirePure metalCopper (Cu)7440-50-80.09182100.000000.17131
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.