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Chemical content 74HC393BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC393BQ-Q100SOT762-1DHVQFN1418.53854 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304367115612601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10050
PolymerResin systemProprietary0.0046319.900000.02497
subTotal0.02326100.000000.12547
DieDoped siliconSilicon (Si)7440-21-30.57021100.000003.07580
subTotal0.57021100.000003.07580
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700036.38210
Iron (Fe)7439-89-60.166072.400000.89583
Phosphorus (P)7723-14-00.002080.030000.01120
Zinc (Zn)7440-66-60.006920.100000.03733
subTotal6.91978100.0000037.32646
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.65133
FillerSilica -amorphous-7631-86-90.367153.490001.98046
Silica fused60676-86-08.9230784.8200048.13255
PigmentCarbon black1333-86-40.016830.160000.09079
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.61286
Epoxy resin systemProprietary0.167271.590000.90227
Phenolic resinProprietary0.236702.250001.27680
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.09963
subTotal10.52001100.0000056.74669
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07467
Nickel (Ni)7440-02-00.4258792.300002.29723
Palladium (Pd)7440-05-30.014303.100000.07715
Silver (Ag)7440-22-40.007381.600000.03982
subTotal0.46140100.000002.48887
WirePure metalCopper (Cu)7440-50-80.0423796.550000.22855
Pure metal layerGold (Au)7440-57-50.000150.350000.00083
Palladium (Pd)7440-05-30.001363.100000.00734
subTotal0.04388100.000000.23672
total18.53854100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.