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Chemical content 74HC4049PW

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Type numberPackagePackage descriptionTotal product weight
74HC4049PWSOT403-1TSSOP1653.49604 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935294435118612601235Suzhou, China; Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.21843
PolymerAcrylic resinProprietary0.0228015.200000.04262
Resin systemProprietary0.010356.900000.01935
subTotal0.15000100.000000.28040
DieDoped siliconSilicon (Si)7440-21-30.88408100.000001.65261
subTotal0.88408100.000001.65261
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.18710
Iron (Fe)7439-89-60.489842.400000.91566
Phosphorus (P)7723-14-00.006120.030000.01145
Zinc (Zn)7440-66-60.020410.100000.03815
subTotal20.41000100.0000038.15236
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.78331
FillerSilica fused60676-86-025.0272079.0000046.78328
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.55316
PigmentCarbon black1333-86-40.063360.200000.11844
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.36877
Non hazardousProprietary1.298884.100002.42799
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.18439
subTotal31.68000100.0000059.21934
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00561
Nickel (Ni)7440-02-00.2910097.000000.54397
Palladium (Pd)7440-05-30.006002.000000.01122
subTotal0.30000100.000000.56080
WirePure metalCopper (Cu)7440-50-80.07196100.000000.13451
subTotal0.07196100.000000.13451
total53.49604100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.