Chemical content 74HC4051D

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Type numberPackagePackage descriptionTotal product weight
74HC4051DSOT109-1SO16137.72004 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337148206532312601235Shanghai, China; Suzhou, China; Jiangyin, China; Jiangsu, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1311577.900000.09523
PolymerAcrylic resinProprietary0.0255915.200000.01858
Resin systemProprietary0.011626.900000.00844
DieDoped siliconSilicon (Si)7440-21-30.58076100.000000.42170
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-848.6504297.4700035.32559
Iron (Fe)7439-89-61.197922.400000.86982
Phosphorus (P)7723-14-00.014970.030000.01087
Zinc (Zn)7440-66-60.049910.100000.03624
Mould CompoundAdditiveNon hazardousProprietary4.026124.700002.92341
FillerSilica fused60676-86-067.6730779.0000049.13815
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.139736.000003.73201
PigmentCarbon black1333-86-40.171320.200000.12440
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.426484.000002.48801
Non hazardousProprietary3.512154.100002.55021
Tetramethylbiphenyl diglycidyl ether85954-11-61.713242.000001.24400
Pre-PlatingPure metal layerGold (Au)7440-57-50.012791.000000.00929
Nickel (Ni)7440-02-01.2408897.000000.90102
Palladium (Pd)7440-05-30.025592.000000.01858
WirePure metalCopper (Cu)7440-50-80.11632100.000000.08446
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.