Chemical content 74HC4051PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4051PW-Q100SOT403-1TSSOP1660.77038 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352984481181112601235Shanghai, China; Suzhou, China; Bangkok, Thailand; Jiangyin, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21792
PolymerAcrylic resinProprietary0.0258415.200000.04252
Resin systemProprietary0.011736.900000.01930
DieDoped siliconSilicon (Si)7440-21-30.58076100.000000.95567
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.78057
Iron (Fe)7439-89-60.475552.400000.78253
Phosphorus (P)7723-14-00.005940.030000.00978
Zinc (Zn)7440-66-60.019810.100000.03261
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39098
Silica fused60676-86-031.0186878.3300051.04243
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.97496
PigmentCarbon black1333-86-40.079200.200000.13033
PolymerEpoxy resin systemProprietary3.509358.862005.77477
Phenolic resinProprietary2.339575.908003.84985
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02483
Nickel (Ni)7440-02-00.4642592.300000.76394
Palladium (Pd)7440-05-30.015593.100000.02566
Silver (Ag)7440-22-40.008051.600000.01324
WirePure metalCopper (Cu)7440-50-80.10215100.000000.16810
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.