Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC4053BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC4053BQSOT763-1DHVQFN1621.498347 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527366811522126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.03000060.0000000.139546
ImpurityNon hazardousProprietary0.0000200.0395000.000092
PolymerResin systemProprietary0.01997639.9514100.092917
subTotal0.050000100.0000000.232555
DieDoped siliconSilicon (Si)7440-21-30.489533100.0000002.277073
subTotal0.489533100.0000002.277073
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000037.414855
Iron (Fe)7439-89-60.1980572.4000000.921265
Phosphorus (P)7723-14-00.0024760.0300000.011516
Zinc (Zn)7440-66-60.0082520.1000000.038386
subTotal8.252360100.00000038.386021
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.726475
FillerSilica -amorphous-7631-86-90.4341023.4900002.019235
Silica fused60676-86-010.55030284.82000049.074944
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.579735
PigmentCarbon black1333-86-40.0203990.1640000.094887
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.141315
Epoxy resin systemProprietary0.1972741.5860000.917624
Phenolic resinProprietary0.2802392.2530001.303535
subTotal12.438460100.00000057.857751
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009744
Nickel (Ni)7440-02-00.19062791.0000000.886704
Palladium (Pd)7440-05-30.0167588.0000000.077952
subTotal0.209480100.0000000.974400
WirePure metalCopper (Cu)7440-50-80.05649696.5500000.262791
Pure metal layerGold (Au)7440-57-50.0002050.3500000.000953
Palladium (Pd)7440-05-30.0018143.1000000.008438
subTotal0.058514100.0000000.272181
total21.498347100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.