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Chemical content 74HC4060BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4060BQ-Q100SOT763-1DHVQFN1621.80892 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298891115612601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13756
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09159
subTotal0.05000100.000000.22924
DieDoped siliconSilicon (Si)7440-21-30.80744100.000003.70234
subTotal0.80744100.000003.70234
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.88204
Iron (Fe)7439-89-60.198062.400000.90815
Phosphorus (P)7723-14-00.002480.030000.01135
Zinc (Zn)7440-66-60.008250.100000.03784
subTotal8.25236100.0000037.83938
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65968
FillerSilica -amorphous-7631-86-90.434103.490001.99048
Silica fused60676-86-010.5503084.8200048.37609
PigmentCarbon black1333-86-40.019900.160000.09125
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61597
Epoxy resin systemProprietary0.197771.590000.90684
Phenolic resinProprietary0.279872.250001.28326
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11025
subTotal12.43846100.0000057.03382
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00961
Nickel (Ni)7440-02-00.1906391.000000.87408
Palladium (Pd)7440-05-30.016768.000000.07684
subTotal0.20948100.000000.96053
WirePure metalCopper (Cu)7440-50-80.0494296.550000.22660
Pure metal layerGold (Au)7440-57-50.000180.350000.00082
Palladium (Pd)7440-05-30.001593.100000.00728
subTotal0.05118100.000000.23470
total21.80892100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.