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Chemical content 74HC423BQ

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Type numberPackagePackage descriptionTotal product weight
74HC423BQSOT763-1DHVQFN1621.94198 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352854281151212601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13672
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09104
subTotal0.05000100.000000.22785
DieDoped siliconSilicon (Si)7440-21-30.93882100.000004.27863
subTotal0.93882100.000004.27863
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.65838
Iron (Fe)7439-89-60.198062.400000.90264
Phosphorus (P)7723-14-00.002480.030000.01128
Zinc (Zn)7440-66-60.008250.100000.03761
subTotal8.25236100.0000037.60991
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.64962
FillerSilica -amorphous-7631-86-90.434103.490001.97841
Silica fused60676-86-010.5503084.8200048.08272
PigmentCarbon black1333-86-40.019900.160000.09070
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61223
Epoxy resin systemProprietary0.197771.590000.90134
Phenolic resinProprietary0.279872.250001.27548
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.09745
subTotal12.43846100.0000056.68795
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00955
Nickel (Ni)7440-02-00.1906391.000000.86878
Palladium (Pd)7440-05-30.016768.000000.07638
subTotal0.20948100.000000.95471
WirePure metalCopper (Cu)7440-50-80.05286100.000000.24091
subTotal0.05286100.000000.24091
total21.94198100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.