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Chemical content 74HC4851BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4851BQ-Q100SOT763-1DHVQFN1622.20819 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298461115912601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.35952
PolymerResin systemProprietary0.0198419.900000.08932
subTotal0.09968100.000000.44884
DieDoped siliconSilicon (Si)7440-21-30.89661100.000004.03728
subTotal0.89661100.000004.03728
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700035.90871
Iron (Fe)7439-89-60.196362.400000.88418
Phosphorus (P)7723-14-00.002450.030000.01105
Zinc (Zn)7440-66-60.008180.100000.03684
subTotal8.18167100.0000036.84078
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.62985
FillerSilica -amorphous-7631-86-90.434103.490001.95470
Silica fused60676-86-010.5503184.8200047.50639
PigmentCarbon black1333-86-40.019900.160000.08961
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.60489
Epoxy resin systemProprietary0.197771.590000.89053
Phenolic resinProprietary0.279872.250001.26019
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.07231
subTotal12.43847100.0000056.00847
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07369
Nickel (Ni)7440-02-00.5035192.300002.26721
Palladium (Pd)7440-05-30.016913.100000.07615
Silver (Ag)7440-22-40.008731.600000.03930
subTotal0.54551100.000002.45635
WirePure metalCopper (Cu)7440-50-80.0446696.550000.20109
Pure metal layerGold (Au)7440-57-50.000160.350000.00073
Palladium (Pd)7440-05-30.001433.100000.00646
subTotal0.04625100.000000.20828
total22.20819100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.