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Chemical content 74HC573BQ

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Type numberPackagePackage descriptionTotal product weight
74HC573BQSOT764-1DHVQFN2027.99876 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736941152212601235Shanghai, China; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24397
PolymerResin systemProprietary0.0169719.900000.06061
subTotal0.08528100.000000.30458
DieDoped siliconSilicon (Si)7440-21-30.31140100.000001.11221
subTotal0.31140100.000001.11221
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.82010
Iron (Fe)7439-89-60.260742.400000.93124
Phosphorus (P)7723-14-00.003260.030000.01164
Zinc (Zn)7440-66-60.010860.100000.03880
subTotal10.86402100.0000038.80178
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70190
FillerSilica -amorphous-7631-86-90.571483.490002.04111
Silica fused60676-86-013.8892084.8200049.60648
PigmentCarbon black1333-86-40.026200.160000.09358
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63163
Epoxy resin systemProprietary0.260361.590000.92990
Phenolic resinProprietary0.368442.250001.31590
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16392
subTotal16.37491100.0000058.48442
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00985
Nickel (Ni)7440-02-00.2509591.000000.89629
Palladium (Pd)7440-05-30.022068.000000.07879
subTotal0.27577100.000000.98493
WirePure metalCopper (Cu)7440-50-80.0843796.550000.30132
Pure metal layerGold (Au)7440-57-50.000310.350000.00109
Palladium (Pd)7440-05-30.002713.100000.00967
subTotal0.08738100.000000.31208
total27.99876100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.