Chemical content 74HC574BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC574BQ-Q100SOT764-1DHVQFN2028.00341 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691307115412601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24393
PolymerResin systemProprietary0.0169719.900000.06060
DieDoped siliconSilicon (Si)7440-21-30.31539100.000001.12625
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.81309
Iron (Fe)7439-89-60.260732.400000.93107
Phosphorus (P)7723-14-00.003260.030000.01164
Zinc (Zn)7440-66-60.010860.100000.03879
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70161
FillerSilica -amorphous-7631-86-90.571483.490002.04077
Silica fused60676-86-013.8892184.8200049.59827
PigmentCarbon black1333-86-40.026200.160000.09356
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63153
Epoxy resin systemProprietary0.260361.590000.92975
Phenolic resinProprietary0.368442.250001.31568
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16357
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00985
Nickel (Ni)7440-02-00.2509691.000000.89618
Palladium (Pd)7440-05-30.022068.000000.07878
WirePure metalCopper (Cu)7440-50-80.0851996.550000.30420
Pure metal layerGold (Au)7440-57-50.000310.350000.00110
Palladium (Pd)7440-05-30.002743.100000.00977
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.