×

Chemical content 74HC74BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC74BQSOT762-1DHVQFN1421.83038 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736721151512601235Bangkok, Thailand; Jiangyin, China; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43297
PolymerResin systemProprietary0.0234819.900000.10757
subTotal0.11800100.000000.54054
DieDoped siliconSilicon (Si)7440-21-30.21261100.000000.97393
subTotal0.21261100.000000.97393
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.60071
Iron (Fe)7439-89-60.205522.346100.94143
Phosphorus (P)7723-14-00.002650.030200.01212
Zinc (Zn)7440-66-60.008890.101500.04073
Pure metal layerGold (Au)7440-57-50.002650.030200.01212
Nickel (Ni)7440-02-00.106921.220500.48976
Palladium (Pd)7440-05-30.004910.056000.02247
Silver (Ag)7440-22-40.001800.020500.00823
subTotal8.76000100.0000040.12757
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69105
FillerSilica -amorphous-7631-86-90.442743.490002.02810
Silica fused60676-86-010.7602784.8200049.29032
PigmentCarbon black1333-86-40.020300.160000.09298
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62761
Epoxy resin systemProprietary0.201711.590000.92398
Phenolic resinProprietary0.285442.250001.30751
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15013
subTotal12.68600100.0000058.11168
WirePure metalCopper (Cu)7440-50-80.0519196.550000.23780
Pure metal layerGold (Au)7440-57-50.000190.350000.00086
Palladium (Pd)7440-05-30.001673.100000.00764
subTotal0.05377100.000000.24630
total21.83038100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.