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Chemical content 74HCT00BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT00BQ-Q100SOT762-1DHVQFN1418.16494 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298901115712601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10257
PolymerResin systemProprietary0.0046319.900000.02548
subTotal0.02326100.000000.12805
DieDoped siliconSilicon (Si)7440-21-30.18786100.000001.03417
subTotal0.18786100.000001.03417
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.13037
Iron (Fe)7439-89-60.166072.400000.91426
Phosphorus (P)7723-14-00.002080.030000.01143
Zinc (Zn)7440-66-60.006920.100000.03809
subTotal6.91978100.0000038.09415
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68529
FillerSilica -amorphous-7631-86-90.367153.490002.02119
Silica fused60676-86-08.9230784.8200049.12250
PigmentCarbon black1333-86-40.016830.160000.09266
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62547
Epoxy resin systemProprietary0.167271.590000.92083
Phenolic resinProprietary0.236702.250001.30306
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14281
subTotal10.52001100.0000057.91381
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07620
Nickel (Ni)7440-02-00.4258792.300002.34447
Palladium (Pd)7440-05-30.014303.100000.07874
Silver (Ag)7440-22-40.007381.600000.04064
subTotal0.46140100.000002.54005
WirePure metalCopper (Cu)7440-50-80.0508296.550000.27976
Pure metal layerGold (Au)7440-57-50.000180.350000.00101
Palladium (Pd)7440-05-30.001633.100000.00898
subTotal0.05263100.000000.28975
total18.16494100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.