×

Chemical content 74HCT00BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT00BQSOT762-1DHVQFN1417.94202 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736971151512601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10384
PolymerResin systemProprietary0.0046319.900000.02580
subTotal0.02326100.000000.12964
DieDoped siliconSilicon (Si)7440-21-30.18786100.000001.04702
subTotal0.18786100.000001.04702
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.91642
Iron (Fe)7439-89-60.167512.400000.93361
Phosphorus (P)7723-14-00.002090.030000.01167
Zinc (Zn)7440-66-60.006980.100000.03890
subTotal6.97956100.0000038.90060
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70623
FillerSilica -amorphous-7631-86-90.367153.490002.04630
Silica fused60676-86-08.9230684.8200049.73277
PigmentCarbon black1333-86-40.016830.160000.09381
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63324
Epoxy resin systemProprietary0.167271.590000.93227
Phenolic resinProprietary0.236702.250001.31925
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16943
subTotal10.52000100.0000058.63330
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00987
Nickel (Ni)7440-02-00.1612391.000000.89862
Palladium (Pd)7440-05-30.014178.000000.07900
subTotal0.17718100.000000.98749
WirePure metalCopper (Cu)7440-50-80.0523196.550000.29152
Pure metal layerGold (Au)7440-57-50.000190.350000.00106
Palladium (Pd)7440-05-30.001683.100000.00936
subTotal0.05417100.000000.30194
total17.94202100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.