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Chemical content 74HCT04BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT04BQ-Q100SOT762-1DHVQFN1417.93304 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298731115512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10389
PolymerResin systemProprietary0.0046319.900000.02581
subTotal0.02326100.000000.12970
DieDoped siliconSilicon (Si)7440-21-30.18104100.000001.00954
subTotal0.18104100.000001.00954
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8028397.4700037.93462
Iron (Fe)7439-89-60.167512.400000.93406
Phosphorus (P)7723-14-00.002090.030000.01168
Zinc (Zn)7440-66-60.006980.100000.03892
subTotal6.97941100.0000038.91928
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70709
FillerSilica -amorphous-7631-86-90.367153.490002.04733
Silica fused60676-86-08.9230784.8200049.75772
PigmentCarbon black1333-86-40.016830.160000.09386
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63356
Epoxy resin systemProprietary0.167271.590000.93274
Phenolic resinProprietary0.236702.250001.31991
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.17052
subTotal10.52001100.0000058.66273
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00988
Nickel (Ni)7440-02-00.1612391.000000.89909
Palladium (Pd)7440-05-30.014178.000000.07904
subTotal0.17718100.000000.98801
WirePure metalCopper (Cu)7440-50-80.0503496.550000.28071
Pure metal layerGold (Au)7440-57-50.000180.350000.00102
Palladium (Pd)7440-05-30.001623.100000.00901
subTotal0.05214100.000000.29074
total17.93304100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.