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Chemical content 74HCT138BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT138BQ-Q100SOT763-1DHVQFN1621.57289 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352987451155126030 s123520 s3Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00462
FillerSilver (Ag)7440-22-40.0747675.000000.34655
PolymerAcrylic resinProprietary0.005986.000000.02772
Resin systemProprietary0.0179418.000000.08317
subTotal0.09968100.000000.46206
DieDoped siliconSilicon (Si)7440-21-30.24383100.000001.13028
subTotal0.24383100.000001.13028
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.96618
Iron (Fe)7439-89-60.196362.400000.91022
Phosphorus (P)7723-14-00.002450.030000.01138
Zinc (Zn)7440-66-60.008180.100000.03793
subTotal8.18167100.0000037.92571
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.72051
FillerSilica -amorphous-7631-86-90.434103.490002.01226
Silica fused60676-86-010.5503184.8200048.90541
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.57773
PigmentCarbon black1333-86-40.020400.164000.09456
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.13392
Epoxy resin systemProprietary0.197271.586000.91445
Phenolic resinProprietary0.280242.253001.29903
subTotal12.43847100.0000057.65787
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07586
Nickel (Ni)7440-02-00.5035192.300002.33397
Palladium (Pd)7440-05-30.016913.100000.07839
Silver (Ag)7440-22-40.008731.600000.04046
subTotal0.54551100.000002.52868
WirePure metalCopper (Cu)7440-50-80.0615396.550000.28522
Pure metal layerGold (Au)7440-57-50.000220.350000.00103
Palladium (Pd)7440-05-30.001983.100000.00916
subTotal0.06373100.000000.29541
total21.57289100.00000100.00000
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