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Chemical content 74HCT138BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT138BQ-Q100SOT763-1DHVQFN1621.57289 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298745115512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37011
PolymerResin systemProprietary0.0198419.900000.09195
subTotal0.09968100.000000.46206
DieDoped siliconSilicon (Si)7440-21-30.24383100.000001.13028
subTotal0.24383100.000001.13028
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.96618
Iron (Fe)7439-89-60.196362.400000.91022
Phosphorus (P)7723-14-00.002450.030000.01138
Zinc (Zn)7440-66-60.008180.100000.03793
subTotal8.18167100.0000037.92571
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67784
FillerSilica -amorphous-7631-86-90.434103.490002.01226
Silica fused60676-86-010.5503184.8200048.90541
PigmentCarbon black1333-86-40.019900.160000.09225
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62271
Epoxy resin systemProprietary0.197771.590000.91676
Phenolic resinProprietary0.279872.250001.29730
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.13334
subTotal12.43847100.0000057.65787
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07586
Nickel (Ni)7440-02-00.5035192.300002.33397
Palladium (Pd)7440-05-30.016913.100000.07839
Silver (Ag)7440-22-40.008731.600000.04046
subTotal0.54551100.000002.52868
WirePure metalCopper (Cu)7440-50-80.0615396.550000.28522
Pure metal layerGold (Au)7440-57-50.000220.350000.00103
Palladium (Pd)7440-05-30.001983.100000.00916
subTotal0.06373100.000000.29541
total21.57289100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.