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Chemical content 74HCT1G08GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT1G08GW-Q100SOT353-1UMT55.48318 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298487125712601235Bangkok, Thailand; Shanghai, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.13678
PolymerResin systemProprietary0.0025025.000000.04559
subTotal0.01000100.000000.18237
DieDoped siliconSilicon (Si)7440-21-30.08038100.000001.46603
subTotal0.08038100.000001.46603
Lead FrameCopper alloyCopper (Cu)7440-50-81.9034196.6200034.71369
Iron (Fe)7439-89-60.041962.130000.76527
Phosphorus (P)7723-14-00.000590.030000.01078
Zinc (Zn)7440-66-60.002560.130000.04671
MetallisationSilver (Ag)7440-22-40.021471.090000.39162
subTotal1.97000100.0000035.92807
Mould CompoundAdditiveNon hazardousProprietary0.090192.900001.64485
Triphenylphosphine603-35-00.001560.050000.02836
FillerSilica -amorphous-7631-86-92.2392072.0000040.83762
PigmentCarbon black1333-86-40.001560.050000.02836
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4665015.000008.50784
Phenol Formaldehyde resin (generic)9003-35-40.3110010.000005.67189
subTotal3.11000100.0000056.71892
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00017
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00028
Tin solderTin (Sn)7440-31-50.3099799.990005.65309
subTotal0.31000100.000005.65366
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0028099.990000.05106
subTotal0.00280100.000000.05107
total5.48318100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.